Join Supermicro at MWC Las Vegas, North America’s largest and most influential connectivity event. The rapid rise of 5G in private and telco networks, edge AI applications, and open standards are driving the need for higher levels of product integration and optimization. Supermicro enables organizations to accelerate the adoption of innovative technologies with a new generation of powerful, versatile, and compact systems to drive performance from the cloud to the intelligent edge.

Visit our booth 814 to discover the latest lineup of purpose-built systems, powered by Intel, AMD and NVIDIA technology and interactive demonstrations of real-world applications from solution partners including HTC, Zscaler, Celona, and Eviden.

 

CONNECTION DENSITY ISSUES & SOLUTIONS

• September 26th, Tuesday, 4:30 PM - 5:30 PM PDT | MWC Stage A - W231, Level 2
• Speakers:  Sanjay Kumar Misra, (AVP, Telecom, Media & Entertainment (TME), HCL Technologies Limited), Ed Lambert, (Lead New Product Development Engineer, AT&T), and Michael Clegg
  (VP & GM, Supermicro)  
• Session Description
  With over 15 billion connected devices worldwide and an outlook that this number will double by 2030, the telecom providers are under more pressure than ever to deliver fast and reliable connections to their customers. This has in turn produced an explosion of network and data usage, causing a connection density issue that has become a major bottleneck for many providers.
  
  In this session, we'll bring together experts from across the telecom industry to discuss the latest trends, technologies, and strategies for addressing connectivity issues. From network automation and optimization, to edge and quantum computing, we'll explore a wide range of solutions to ease this issue and provide actionable insights for telecom providers looking to stay ahead of the curve.